Proposal for improvement the welding process of the micro- USB connector on the mother board on tablets
Item
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Tipo do ITEM
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Artigo Ciêntifico
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Título do Artigo
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Proposal for improvement the welding process of the micro- USB connector on the mother board on tablets
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Descrição
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The current electrical and electronic products industry have features extremely dynamic and with constant search for improvement in
their manufacturing processes, seeking greater efficiency and lower costs. In the manufacturing process of the main board on tablets,
in the area of welding technology, there was a problem in the micro USB connector soldering process causing high defect rates. The
purpose of this article was to conduct assessment and proposal for improvement in this process. The methods and techniques used
were quality tools PDCA cycle, cause and effect diagram and 5W2H. Among these solutions, the choice was to implement pallets of
durestone to maintain the alignment of the connector on the reflow soldering oven. The results show a reduction in failure rates from
12.40% to 0.09% in the production line, which avoided the institution generate a total of 24,800 defective boards on the total to be
produced. The total cost savings from logistics repair of these boards was approximately 70.002,80. USD
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Abstract
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The current electrical and electronic products industry have features extremely dynamic and with constant search for improvement in
their manufacturing processes, seeking greater efficiency and lower costs. In the manufacturing process of the main board on tablets,
in the area of welding technology, there was a problem in the micro USB connector soldering process causing high defect rates. The
purpose of this article was to conduct assessment and proposal for improvement in this process. The methods and techniques used
were quality tools PDCA cycle, cause and effect diagram and 5W2H. Among these solutions, the choice was to implement pallets of
durestone to maintain the alignment of the connector on the reflow soldering oven. The results show a reduction in failure rates from
12.40% to 0.09% in the production line, which avoided the institution generate a total of 24,800 defective boards on the total to be
produced. The total cost savings from logistics repair of these boards was approximately 70.002,80. USD
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Língua do arquivo
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inglês
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Data da Publicação
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Ano 2016
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Palavra-chave
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weldability
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quality tools
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SMT process
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tablet
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Autores
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Cristiano Mourão da Fonseca
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Jandecy Cabral Leite
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Carlos Alberto de Oliveira Freitas
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Antonio da Silva Vieira
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Roberto Tetsuo Fujiyama
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Local
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UFPA - Belém, 2016
