Reducing Defective Indexes in the Printing Process of the Computer Plates with the Application of the Welding Paste
Item
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Tipo do ITEM
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Artigo Ciêntifico
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Título do Artigo
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Reducing Defective Indexes in the Printing Process of the Computer Plates with the Application of the Welding Paste
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Descrição
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Abstract— The process of automatic assembly of the smaller components in the plate making industries
represents an important manufacturing activity that influences all stages of production. Thus, it is necessary that
from the beginning of this process there is a technical follow-up regarding the development of the assembly of
the computer boards. The most important process in the manufacture of these plate s is the welding process,
where 70% of the defects occur, are found from the application of weld. In order to minimize the defects that
occurred in the process phase called SMT (Surface Mount Technology) a study was made on the most frequent
defects within this process with the use of 5W2H tools and the Ishikawa Diagram. Thus, the project aims to
reduce defect rates in order to extend product life and continuous improvement in the automatic assembly
process of smaller components.
Keywords— Welding Process; Surface Mount Technology; Solder Paste.
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Abstract
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Abstract— The process of automatic assembly of the smaller components in the plate making industries
represents an important manufacturing activity that influences all stages of production. Thus, it is necessary that
from the beginning of this process there is a technical follow-up regarding the development of the assembly of
the computer boards. The most important process in the manufacture of these plate s is the welding process,
where 70% of the defects occur, are found from the application of weld. In order to minimize the defects that
occurred in the process phase called SMT (Surface Mount Technology) a study was made on the most frequent
defects within this process with the use of 5W2H tools and the Ishikawa Diagram. Thus, the project aims to
reduce defect rates in order to extend product life and continuous improvement in the automatic assembly
process of smaller components.
Keywords— Welding Process; Surface Mount Technology; Solder Paste.
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Língua do arquivo
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inglês
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Data da Publicação
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Ano 2019
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Palavra-chave
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Welding Process
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Surface Mount Technology
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Solder Paste
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Autores
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Vanessa Silva Souza
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Marden Eufrasio dos Santos
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David Barbosa de Alencar
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Local
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ITEGAM - Manaus, 2019
